The unique IPD technology developed by IPDiA is a highly efficient way of integrating tens or even hundreds of passive components. Moreover, the performances resulting from this technology exceed those obtained with traditional SMDs.The size of application boards could easily be reduced by a factor of more than 10 to create unprecedented innovative products.In addition, greater reliability and significant cost reductions can be achieved by replacing external SMD components by customized IPD dies.
IPDiA's primary objective is to focus on two main axes: Silicon Submount for high brightness LEDs and Integrated Passive Devices for medical, industrial, communication and high reliability markets.
IPDiA is a spin-out of NXP, the company was formed on June 2009. The creation of IPDiA is the result of more than 10 years of Research and Development carried out in large international groups - Philips & NXP - which led to the invention of innovative 3D technologies to integrate Passive Devices.
Company headquarters are located in Caen, Normandy, France. The company operates design centers, sales and marketing offices and a manufacturing facility certified ISO 9001 / 14001 / 18001 as well as ISO TS 16949 for the Automotive market and ISO 13485 for medical devices.
IPDiA is supported in terms of Sales and R&D by an IPDiA office in Montreal (IPDiA Electronic Components Inc) and by a wide international sales network in north America, Asia and Europe.
IPDiA has been granted with the Authorised Economic Operator (AEO) in 2012 reaching thus the grade of excellence in the following criteria: customs compliance, appropriate record-keeping, appropriate security and safety standards.