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Market Segment / Communications

IPDiA 3D silicon passive integration technology offers the most significant advantages in the RF domain: miniaturization, performance and reduced cost. Integrating and manufacturing passive devices on IPDiA 3D Silicon exclusive technology results in smaller size, lower thickness and higher performance - higher self–resonance frequency (low ESR, low ESL and low coupling), higher reliability (no cracking unlike MLC), higher stability in temperature, voltage and aging - compared with standard discrete passive devices (SMD).

APPLICATION SEGMENTS

  • Mobile communications (DECT, GSM, WCDMA, LTE)
  • Wireless LANs (WiFi™), UWB, WiMAX, Bluetooth™
  • Satellite TV Receivers, Radar, Microwave, Optical
  • Galileo, GPS (military, civil)
  • Industrial (RFID, sensors)
  • Vehicle Location Systems