IPDiA at IMS 2013, Seattle, from June 4 to 6, 2013.
Visit us and check how our Ultra Miniaturized Products can help in your RF Designs!
Be sure to visit IPDiA at IMS 2013, June 4-6, in Seattle, booth 1535 where we'll have exciting offerings and technology experts on hand to answer your questions and discuss new business opportunities.
Come to discover the Integrated Passive Device technology from IPDiA, that enables a wide variety of RF passive devices, such as baluns, filters, couplers and diplexers to be integrated on a high resistivity silicon substrate.
IPDiA technology enables the realization of passive components and component networks that can replace all or part of passives in electronic designs and leads to amazing miniaturization (thickness down to 30 µm), performance and reliability for applications with critical space constraint (Multi Chip Module (MCM), System In Package (SIP)).
To get an appointment, please contact us: firstname.lastname@example.org