Home >> Our Products >> 3D Silicon Capacitors
3D Silicon Capacitors
![]()
IPDiA developed a unique technology to integrate a wide range of capacitor values on silicon. IPDiA Silicon Capacitors offer unprecedented performance and considerably ease system integration through miniaturization. More than 1 billion consumer devices already benefit from this groundbreaking technology thus proving its maturity and reliability.
IPDiA High Density Capacitors can be used throughout a wide range of applications covering such diverse functions as power decoupling, signal coupling, pump charging, DC/DC power conversion, etc.
Silicon capacitors are probably the best choice in capacitors for all demanding applications.
Thanks to the unique IPDiA Silicon capacitor technology many of the problems encountered by application designers can be solved.
Strong volume constraints
Capacitor integration capability up to 2 µF/mm3
High reliability
Elimination of crack phenomena, unlike MLCC
Battery lifetime, requiring low leakage current on capacitors
Very low leakage current (<500 pA for a 200 nF capacitor at 3.6 V)
Efficient decoupling with minimum embedded capacitors
Very stable capacitor value over the full operating voltage & temperature ranges
Oversizing of capacitor value (often by a factor of 2) for sensitive capacitive circuitry to secure the amount of energy stored in the capacitors, whatever the operating voltage
Higher DC voltage stability (< 0.1 %/V)
High temperature cycling during manufacturing operations
Silicon based process compatible with high temperature cycling (exceeding 300 °C)
IPDiA Silicon capacitor offers design services, to develop an optimized solution for any specific application requirements.
Key Features
- Thin capacitors (down to 100 µm)
- Smaller footprint than most MLCC, tantalum
- Record low ESL, tunable ESR
- Very high stability up to 200 °C
- Shorter interconnections for lower package parasitics
- High reliability (silicon standards)
- Compatible with any packaging/assembly configuration: wire bonds, bumping, laminates, leadframes, WL-CSP
Key Applications
- All demanding applications
- High-efficiency decoupling design
- Space constraint decoupling
- RF and microwave capacitor
- Portable device
- High temperature applications
- System in package
- Embedded die package