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Wire Bonding Silicon Vertical Capacitors

Product Description

Murata SiCaps are the ultimate solution for decoupling. In some demanding applications, bypass grounding must be located as close as possible to the active element. Thanks to the vertical Capacitor, decoupling can be fitted inside the packaging.

Key Benefits

Decoupling in demanding applications
Low leakage current
High stability
Extended temperature range


Key Features

Ground connection to the back of the Silicon capacitor
Wirebond connection on top for the voltage line
Delivered in wafer forms, in single bare or packaged parts
Thickness: 250 m / 100 m

Type of Document Capacitance value Temperature range Breakdown Voltage Die Thickness PDF
WBSC/WTSC/WXSC Commercial Leaflet 100 pF > 22 nF -55C / +250C 11 V; 30 V; 50 V; 150 V 250 m PDF
WLSC Commercial Leaflet 47 pF > 22 nF -55C / +150C 11 V;30 V; 50 V; 150 V 100 m PDF
WBSC Assembly Note 100 pF > 22 nF -55C / +150C 11 V; 30 V; 50 V; 150 V 250 m PDF
WTSC Assembly Note 100 pF > 22 nF -55C / +200C 11V; 30 V; 50 V; 150 V 250 m PDF
WXSC Assembly Note 100 pF > 22 nF -55C / +250C 11 V; 30 V; 50 V; 150 V 250 m PDF
VIDEO: Murata Mounting Capacitors (wire bonding) Vido
WLSC Assembly Note 47 pF > 22 nF -55C / +150C 11 V; 30 V; 50 V; 150 V 100 m PDF
Silicon Capacitors Catalogue PDF