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Wire Bonding Silicon Vertical Capacitor
Product Description
Decoupling in some demanding applications must be located as near as possible to the active element. Thanks to the vertical Capacitor, decoupling could be fitted inside the packaging.
Key Benefits
• Decoupling in demanding applications
• Low leakage current
• High stability
• Extended temperature range
Key Features
• Ground connection to the back of the Silicon capacitor
• Wirebond connection on top for the voltage line
• Delivered in wafer forms, in single bare or packaged parts
• Thickness 250 µm
| Capacitance value | Temperature range | Breakdown Voltage | ||||
|---|---|---|---|---|---|---|
| 10pF > 22nF | -55°C / +150°C | 30V; 50V; 150V |
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| 10pF > 22nF | -55°C / +200°C | 30V; 50V; 150V |
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| 10pF > 22nF | -55°C / +250°C | 30V; 50V; 150V |
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| VIDEO : IPDiA Mounting Capacitors (wire bonding) |
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