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Wire Bonding Silicon Vertical Capacitors

Product Description

IPDiA SiCaps are the ultimate solution for decoupling. In some demanding applications, bypass grounding must be located as close as possible to the active element. Thanks to the vertical Capacitor, decoupling can be fitted inside the packaging.

Key Benefits

Decoupling in demanding applications
Low leakage current
High stability
Extended temperature range


Key Features

Ground connection to the back of the Silicon capacitor
Wirebond connection on top for the voltage line
Delivered in wafer forms, in single bare or packaged parts
Thickness: 250 m / 100 m

Type of Document Capacitance value Temperature range Breakdown Voltage Die Thickness PDF
WBSC/WLSC Commercial Leaflet 47 pF > 22 nF -55C / +150C 30 V; 50 V; 150 V 250 m / 100 m PDF
WTSC Commercial Leaflet 1 nF > 22 nF -55C / +200C 30 V; 50 V; 150 V 250 m PDF
WXSC Commercial Leaflet 1 nF > 22 nF -55C / +250C 30 V; 50 V; 150 V 250 m PDF
WBSC Assembly Note 47 pF > 22 nF -55C / +150C 30 V; 50 V; 150 V 250 m PDF
WTSC Assembly Note 1 nF > 22 nF -55C / +200C 30 V; 50 V; 150 V 250 m PDF
WXSC Assembly Note 1 nF > 22 nF -55C / +250C 30 V; 50 V; 150 V 250 m PDF
WLSC Assembly Note 47 pF > 10 nF -55C / +150C 30 V; 50 V; 150 V 100 m PDF
VIDEO: IPDiA Mounting Capacitors (wire bonding) Vido
Silicon Capacitors Catalogue PDF