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Wire Bonding Silicon Vertical Capacitor

Product Description

IPDiA SiCaps are the ultimate capacitor for decoupling. In some demanding applications, bypass grouding must be located as near as possible to the active element. Thanks to the vertical Capacitor, decoupling could be fitted inside the packaging.

Key Benefits

Decoupling in demanding applications
Low leakage current
High stability
Extended temperature range


Key Features

Ground connection to the back of the Silicon capacitor
Wirebond connection on top for the voltage line
Delivered in wafer forms, in single bare or packaged parts
Thickness 250 m

Capacitance value Temperature range Breakdown Voltage PDF
10pF > 22nF -55C / +150C 30V; 50V; 150V PDF
10pF > 22nF -55C / +200C 30V; 50V; 150V PDF
10pF > 22nF -55C / +250C 30V; 50V; 150V PDF
IPD Capacitor Assembly set up PDF
VIDEO : IPDiA Mounting Capacitors (wire bonding) PDF