coin page

Home >> Our Products >> Wirebond & Embedded Silicon Capacitors 100m/250m

Wirebond & Embedded Silicon Capacitors 100m/250m

Product Description

IPDiA Wirebond & Embedded Silicon Capacitors (SiCaps) are designed to be compliant with embedding process for printed circuit board and laminates.
Thanks to the high robustness and reliability of these silicon passive components, embedded processes are now becoming a reality.

Key Benefits

Very low profile down to 100 m (80 m on request)
Low leakage current
Low ESL and ESR
High capacity value up to 4.7 F
High reliability
Extended temperature range

Key Features

Breakdown voltage 11 V; 30 V
Several finishings available
Delivered in wafer forms, in single bare or packaged parts


Type of document Capacitance value Temperature range Die thickness Breakdown Voltage PDF
EMSC Commercial Leaflet 10 nF -> 4.7 F -55C / +150C 100 m 11 V; 30 V PDF
ETSC Commercial Leaflet 10 nF -> 4.7 F -55C / +200C 250 m 11 V; 30 V PDF
EXSC Commercial Leaflet 10 nF -> 4.7 F -55C / +250C 250 m 11 V; 30 V PDF
EMSC Assembly Note 10 nF -> 4.7 F -55C / +150C 100 m 11 V; 30 V PDF
ETSC Assembly Note 10 nF -> 4.7 F -55C / +200C 250 m 11 V; 30 V PDF
EXSC Assembly Note 10 nF -> 4.7 F -55C / +250C 250 m 11 V; 30 V PDF
VIDEO : IPDiA Mounting Capacitors (wire bonding) Vido
Silicon Capacitors Catalogue PDF
White Paper 'Aerospace performances of IPDiA SiCaps' PDF