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Wirebond & Embedded Silicon Capacitors

Product Description

IPDiA Wirebond & Embedded Silicon Capacitors are designed to be compliant with embedding process for printed circuit board and laminates.
Thanks to the high robustness and reliability of these silicon passive components, embedded processes are now becoming a reality.

Key Benefits

• Very low profile down to 80µm
• Low leakage current
• Low ESL and ESR
• High capacity value up to 4.7µF
• High reliability
• Extended temperature range

Key Features

• Breakdown voltage 11V; 30V
• Several finishings available
• Delivered in wafer forms, in single bare or packaged parts


Capacitance value Temperature range Die thickness Breakdown Voltage PDF
10nF > 4.7µF -55°C / +150°C 100µm 11V; 30V PDF
10nF > 4.7µF -55°C / +200°C 250µm 11V; 30V PDF
10nF > 4.7µF -55°C / +250°C 250µm 11V; 30V PDF
VIDEO : IPDiA Mounting Capacitors (wire bonding) PDF