Wirebond & Embedded Silicon Capacitors 100µm/250µm
IPDiA Wirebond & Embedded Silicon Capacitors (SiCaps) are designed to be compliant with embedding process for printed circuit board and laminates.
Thanks to the high robustness and reliability of these silicon passive components, embedded processes are now becoming a reality.
• Very low profile down to 100 µm (80 µm on request)
• Low leakage current
• Low ESL and ESR
• High capacity value up to 4.7 µF
• High reliability
• Extended temperature range
• Breakdown voltage 11 V; 30 V
• Several finishings available
• Delivered in wafer forms, in single bare or packaged parts