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Baluns/Transformers

Product Description

IPDiA baluns have been specifically designed for applications where space and performance constraints are important in the GSM, DCS, WCDMA, WLAN (WiFi™) and WiMax frequency ranges.
Thanks to IPDiA’s proprietary IPD technology, IPDiA baluns offer a 50 % gain in footprint compared with non-silicon solutions

Key Benefits

• Extremely low insertion loss
. 0.5 dB (typ) for dual-band WiFi™
. 0.75 dB (typ.) for DCS & WiFi™
. 0.95 dB (typ.) for GSM & WiMax
• Return loss >12 dB
• Smaller than SMDs
• Directly attachable on PCB or flipped on PCB
• Temperature stability

Key Features

• Passive integration on Silicon
• Low insertion loss
• Unbal./bal. impedance:
• 50Ω/50Ω or 100Ω/50Ω or 200Ω/50Ω
• Frequency range: 824MHz to 5900MHz
• Operating temperature range: -40°C to +150°C
• WLCSP package
. 150 µm – 300 µm bump size
. 400 µm or 500 µm bump pitch